# US 6,720,524 B1 · Method and apparatus for laser drilling > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,720,524 B1 - Document ID: US6720524B1 - Status: Granted - Kind: B1 - Application number: 10/089,063 - Filed: 2002-04-05 - Granted: 2004-04-13 - Earliest claimed: 1999-10-07 - Assignees: Sumitomo Heavy Industries, Ltd. - Inventors: Shiro Hamada - Web page: https://patentgrep.com/patent/US6720524B1 ## CPC - B23K 26/0738: {into a linear shape} - B23K 26/066: by using masks - B23K 26/073: Shaping the laser spot - B23K 26/082: Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head - B23K 26/0821: {using multifaceted mirrors, e.g. polygonal mirror} - B23K 26/382: by boring - B23K 26/40: taking account of the properties of the material involved - H05K 3/0026: {by laser ablation} - B23K 2101/40: Semiconductor devices - B23K 2103/42: {Plastics other than composite materials} - B23K 2103/50: {Inorganic materials other than metals or composite materials} - B23K 2103/52: {Ceramics} - H05K 2203/0557: Non-printed masks - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A polygon mirror 11, a mask 12 having a row of holes for defining a processing pattern, a galvano-mirror 16, and a processing lens 17are arranged in that order between a laser oscillator 10 and a printed circuit board 20 as a workpiece, and the laser beam from the laser oscillator 10 is projected onto the printer circuit board 20 traveling through these components. The polygon mirror 11 sweeps the laser beam so that the laser beam scans the holes of the mask 12 for the mirror on each face, and a plurality of holes are thereby formed into the printed circuit board 20. The irradiation region of the laser beam to the printer circuit board 20 is shifted in one axis direction by the galvano-mirror 16. ## Claims ### Claim 1 A laser drilling method for carrying out drilling by irradiating a workpiece with a laser beam from a laser oscillator, wherein said laser beam is projected traveling through a polygon mirror, a mask having a mask pattern including a plurality of holes for defining a processing pattern, at least one galvano-mirror, and a processing lens, said polygon mirror sweeps said laser beam so that said laser beam scans across the plurality of holes in said mask to thereby forming a plurality of holes into said workpiece, and an irradiation region of said laser beam onto said workpiece is shifted in one axis direction by said at least one galvano-mirror. ### Claim 2 (depends on 1) The laser drilling method according to claim 1, wherein two galvano-mirrors are provided, and the irradiation region of said laser beam onto said workpiece is shifted by one of the galvano-mirrors in one axis direction while the irradiation region of the laser beam onto said workpiece is shifted by other one of the galvano-mirrors in the direction which is orthogonal to said one axis direction. ### Claim 3 A laser drilling method for carrying out drilling by irradiating a workpiece with a laser beam from a laser oscillator, wherein said laser beam is projected traveling through a shaping optical system for shaping the laser beam into a line or rectangle, a polygon mirror, a mask having a mask pattern including a plurality of holes for defining a processing pattern, at least one galvano-mirror, and a processing lens, said polygon mirror sweeps said laser beam so that the laser beam scans across the plurality of holes in said mask to thereby collectively forming a plurality of holes into said workpiece, and an irradiation region of said laser beam is shifted in one axis direction by said at least one galvano-mirror. ### Claim 4 (depends on 3) The laser drilling method according to claim 3, wherein two galvano-mirrors are provided, and the irradiation region of said laser beam onto said workpiece is shifted by one of the galvano-mirrors in one axis direction while the irradiation region of said laser beam onto said workpiece is shifted by other one of the galvano-mirrors in the direction which is orthogonal to said one axis direction. ### Claim 5 (depends on 3, 4) The laser drilling method according to either claim 3 or 4, wherein, by arranging a masking mechanism in an optical path between said laser oscillator and said mask, the irradiation of said laser beam is avoided during shifting the irradiation region of said laser beam. ### Claim 6 A laser drilling apparatus for carrying out drilling by irradiating a workpiece with a laser beam from a laser oscillator, wherein: a polygon mirror, a mask having a mask pattern including a plurality of holes for defining a processing pattern, at least one galvano-mirror, and a processing lens are arranged between said laser oscillator and said workplace, the laser beam from said laser oscillator being projected onto said workpiece traveling through these components, said polygon mirror sweeps said laser beam so that the laser beam scans across the plurality of holes in said mask to thereby forming a plurality of holes into said workpiece, and an irradiation region of said laser beam is shifted in one axis direction by said at least one galvano-mirror. ### Claim 7 (depends on 6) The laser drilling apparatus according to claim 6, wherein two galvano-mirrors are provided, and the irradiation region of said laser beam onto said workpiece is shifted by one of the galvano-mirrors in one axis direction while the irradiation region of said laser beam onto said workpiece is shifted by other one of the galvano-mirrors in the direction which is orthogonal to said one axis direction. ### Claim 8 A laser drilling apparatus for carrying out drilling by irradiating a workpiece with a laser beam from a laser oscillator, wherein: a shaping optical system for shaping said laser beam into a line or rectangle, a polygon mirror, a mask having a mask pattern including a plurality of holes for defining a processing pattern, at least one galvano-mirror, and a processing lens are arranged between said laser oscillator and said workpiece, the laser beam from said laser oscillator being projected onto said workpiece traveling through these components, said polygon mirror sweeps said laser beam so that the laser beam scans across the plurality of holes in said mask to thereby collectively forming a plurality of holes into said workpiece, and an irradiation region of said laser beam is shifted in one axis direction by said at least one galvano-mirror. ### Claim 9 (depends on 8) The laser drilling apparatus according to claim 8, wherein two galvano-mirrors are provided, and the irradiation region of said laser beam onto said workpiece is shifted by one of the galvano-mirrors in one axis direction while the irradiation region of said laser beam onto said workplace is shifted by other one of the galvano-mirrors in the direction which is orthogonal to said one axis direction. ### Claim 10 (depends on 8, 9) The laser drilling apparatus according to either claim 8 or 9, wherein a masking mechanism is arranged in an optical path between said laser oscillator and said mask to avoid the irradiation of said laser beam during shifting the irradiation region of said laser beam.