System and method of laser drilling
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsXinbing Liu, Chen-Hsiung Cheng
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsXinbing Liu, Chen-Hsiung Cheng
Estimating the term…
The present invention is a system for laser micromachining where a scan mirror and milling algorithm are used to produce high precision, controlled hole shapes in a workpiece. A picosecond laser that produces short pulses is used to reduce thermal effects to improve the quality and repeatability of the milled holes, and a Diffractive Optical Element (DOE) is used to split a single beam into a plurality of beams to allow parallel drilling of the workpiece. A method for operating a laser drilling system where high precision, controlled hole shapes in a workpiece are drilled includes using a scan mirror and milling algorithm, and using a picosecond laser in conjunction with a DOE, thus ensuring that spectral bandwidth issues and thermal issues are addressed to improve the quality and repeatability of the holes.
A picosecond laser micromachining system comprising:
A method of producing a laser milled workpiece with a picosecond laser system, the method comprising:
A method of controlling light beam intensity distribution in a laser drilling system comprising:
A method of designing a microfilter to control beam intensity, the method comprising:
An apparatus for controlling light beam intensity, the apparatus comprising:
A method for correcting reflection angles from a PZT scan mirror comprising:
A method for correcting hysteresis effect in a PZT scan mirror comprising:
A method for operating a PZT scan mirror comprising:
A laser micromachining system comprising:
Dependencies are inferred from the claim text.