Integrated circuit structure
AssigneeInternational Business Machine Corporation
InventorsDavid J. Alcoe, Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge, Cheryl L. Tytran-Palomaki
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Abstract
A semiconductor chip carrier having an increased chip connector and plated through hole density. In particular, a substrate having a plurality of plated through holes therein, and a fatigue resistant redistribution layer thereon. The redistribution layer includes a plurality of vias selectively positioned over and contacting the plated through holes. The substrate further including a ground plane, two pair of signal planes, and two pair of power planes, wherein the second pair of power planes are located directly underneath the external dielectric layer. A buried plated through hole within the substrate.
Claims12
An interconnect structure comprising:
- a substrate;
- a plated through hole positioned within the substrate;
- a redistribution layer on a first and a second surface of the substrate;
- and
- a via within the redistribution layer, and a connection pad connected to the via, centered over and electrical connected to the plated through hole, wherein the substrate comprises:
- a ground plane;
- a first dielectric layer over a first and a second side of the ground plane;
- a first pair of first signal planes, one over each first dielectric layer;
- a second dielectric layer substantially over each first signal plane;
- a first pair of first power planes, one over each second dielectric layers;
- a third dielectric layer substantially over each first power plane;
- a second pair of second signal planes, one over each third dielectric layer;
- a fourth dielectric layer substantially over each second signal plane;
- and
- a second pair of second power planes, one over each fourth dielectric layer.
An interconnect structure comprising:
- a substrate;
- a plated through hale positioned wherein the substrate;
- a redistribution layer on a first and a second surface of the substrate;
- and
- a via within the redistribution layer, and a connection pad connected to the via, centered over and electrically connected to the plated through hole wherein the plated through hole further includes a fill material.
Dependencies are inferred from the claim text.