Back to results
US 6,720,430 B2Granted
Monomer for chemical amplified photoresist compositions
AssigneeEverlight USA, Inc.
InventorsChi-Sheng Chen, Yen-Cheng Li, Meng-Hsum Cheng
Life of this patent
Estimating the term…
Abstract
The present invention discloses a compound having the following formula (I), wherein R1 is H, haloalkyl group or C1-C4 alkyl group; R2 is hydroxyl group, C1-C8 alkoxy group or C1-C8 thioalkyl group; G is (CH2)n, O or S, wherein n is 0, 1, 2, 3 or 4; Rc is a lactone group; and m is 1, 2 or 3. This compound is a monomer and suitable for synthesis to form polymers with good hydrophilicity, adhesion and dry-etch resistance. Particularly, this compound can form photosensitive polymers or copolymers by reacting with suitable photosensitive monomers.
Claims14
A compound of the following formula (I),
- wherein:
- R1 is H, haloalkyl group or C1-C4 alkyl group;
- R2 is hydroxyl, C1-C8 alkoxy group or C1-C8 thioalkyl group;
- G is (CH2)n, O or S, wherein n is 0, 1, 2, 3 or 4;
- Rc is a lactone group;
- and
- m is 1, 2 or 3.
4 more elements
Dependencies are inferred from the claim text.