Methods of forming spin on glass layers by curing remaining portions thereof
AssigneeSamsung Electronics Co., Ltd.
InventorsMin-hee Cho, Chang-hyun Cho, Soo-ho Shin, Hong-sik Jeong
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Abstract
Methods of forming a spin-on-glass (SOG) layer are disclosed. An SOG layer is formed on an integrated circuit substrate. A first curing process is performed on the SOG layer. Less than all of the SOG layer is removed from the integrated circuit substrate through a mask pattern on the SOG layer to provide a remaining portion of the SOG layer on the integrated circuit substrate. A second curing process is performed on the SOG layer. The remaining portion of the SOG layer is removed to expose the integrated circuit substrate.
Claims14
A method of forming a Spin-On-Glass (SOG) layer in an integrated circuit, the method comprising:
- forming an SOG layer on an integrated circuit substrate;
- performing a first curing process on the SOG layer;
- removing less than all of the SOG layer from the integrated circuit substrate through a mask pattern on the SOG layer to provide a remaining portion of the SOG layer on the integrated circuit substrate;
- performing a second curing process on the remaining portion of the SOG layer;
- and
- removing the remaining portion of the SOG layer to expose the integrated circuit substrate.
Dependencies are inferred from the claim text.