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US 6,720,270 B1Granted
Method for reducing size of semiconductor unit in packaging process
AssigneeSiliconware Precision Industries Co., Ltd.
InventorChin-Huang Chang
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AssigneeSiliconware Precision Industries Co., Ltd.
InventorChin-Huang Chang
Estimating the term…
The present invention provides different schemes for reducing the size (such as thickness) of at least a semiconductor unit (such as an IC chip) which is to be packaged. It replaces, in packaging at least a semiconductor unit, conventional grinding processes by etching schemes, particularly when the thickness of the semiconductor unit approximates an expected specification. The etching process may be embodied in a way that a semiconductor unit attached to a carrier such as a substrate, or placed onto a seating apparatus such as a chip tray, and properly shielded, is etched by means of using gas such as plasma, or beams of light. The semiconductor unit packaged according to the scheme provided by the present invention can thus be immunized against the failure resulting from die crack or back-side chipping.
A method for reducing the thickness of an entire semiconductor chip or die in a process of making a package including a carrier and said semiconductor chip or die, said semiconductor chip or die including a first surface and a second surface, said second surface having no electrical connection device thereon, said carrier being physically separate from said semiconductor chip or die, said method comprising:
A method for reducing the thickness of an entire semiconductor chip or die in a process of lead-on-chip packaging wherein said semiconductor chip or die includes a first surface and a second surface, said first surface having at least an electrical connection device thereon, said second surface having no electrical connection device thereon, said method comprising:
A method for reducing the thickness of an entire semiconductor chip or die in a process of packaging said semiconductor chip or die wherein said semiconductor chip or die includes a first surface and a second surface, said second surface having no electrical connection device thereon, said method comprising:
Dependencies are inferred from the claim text.