Method for fabricating a circuit device
AssigneeSanyo Electric Co., Ltd.
InventorsYusuke Igarashi, Noriaki Sakamoto, Yoshiyuki Kobayashi, Takeshi Nakamura
Life of this patent
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Abstract
A conductive plated layer 4 is formed after through holes 21 are formed in the insulation resin 2 by using an insulation resin sheet 1 overcoated on a single side of the conductive layer 3 with insulation resin 2. A multi-layer connection structure can be achieved by the second conductive path layer 6 which is connected, in multi layers, to the first conductive path layer 5 formed by etching the conductive plated layer 4. Further, since semiconductor elements 7 are adhered to and fixed at the overcoating resin 8 that covers the first conductive path layer 5, the first conductive path layer 5 is finely patterned, and routing thereof can be made free.
Claims17
A method for fabricating a circuit device, comprising:
- preparing an insulation resin sheet having a surface of a conductive layer coated with insulation resin;
- forming holes in said insulation resin at appointed points on said insulation resin sheet, and selectively exposing the rear side of said conductive layer;
- forming a conductive plated layer in said holes and on the surface of said insulation resin;
- forming a first conductive path layer by etching said conductive plated layer to an appointed pattern;
- fixing semiconductor elements on said first conductive path layer;
- providing a sealing resin layer over said first conductive path layer and said semiconductor elements;
- forming a conductive path layer by etching said second conductive layer to an appointed pattern;
- and
- forming external electrodes at appointed points of said second conductive path layer.
Dependencies are inferred from the claim text.