Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device

A method of making a leadframe, comprising the steps of:

• a) forming a frame rail, multiple inner lead portions and a die pad out of a single metal plate, wherein the inner lead portions are supported by a first group of joining/supporting members that extend inward from the frame rail, and are joined together by a second group of joining/supporting members;
• b) forming convex portions on a surface of the inner lead portions so that the convex portions are spaced apart from each other, the surface being opposite to a surface of the die pad on which a chip will be mounted;
• c) placing a lead retaining member on respective surfaces of the inner lead portions and the frame rail and thereby getting the inner lead portions and the frame rail retained by the retaining member, the surfaces on which the retaining member is placed being either the same as, or opposite to, the surface of the die pad on which the chip will be mounted;
• and
• d) selectively isolating the inner lead portions by removing, from at least some of the joining/supporting members of the second group for the inner lead portions, respective parts thereof located between adjacent ones of the convex portions or between one of the convex portions and the die pad that are adjacent to each other.

A method of making a leadframe, comprising the steps of:

• a) forming a frame rail, lands, inner leads and a die pad out of a single metal plate, wherein the lands are supported by joining/supporting members extending inward from the frame rail and are joined together so as to be spaced apart from each other, the inner leads electrically connect some of the lands together and the die pad has a surface on which a chip will be mounted;
• b) placing a lead retaining member on respective surfaces of the lands and the frame rail and thereby getting the lands and the frame rail retained by the retaining member, the surfaces on which the retaining member is placed being either the same as, or opposite to, the surface of the die pad on which the chip will be mounted;
• and
• c) removing, from at least some of the joining/supporting members, respective parts thereof located between adjacent ones of the lands, thereby selectively isolating the lands.

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) forming frame rails, die pads and multiple sets of internal and external inner lead portions out of a single metal plate, wherein each said die pad is supported by joining/supporting members that extend inward from associated one of the frame rails, each said set of internal inner lead portions are connected to associated one of the die pads so as to surround the die pad, and each said set of external inner lead portions are connected to associated one of the frame rails;
• b) forming convex portions in respective parts of the internal and external inner lead portions so that each said convex portion formed in that part of associated one of the internal inner lead portions is spaced apart from the associated die pad and that each said convex portion formed in that part of associated one of the external inner lead portions is spaced apart from the associated frame rail, the convex portions being formed on respective surfaces of the internal and external inner lead portions opposite to an upper surface of the die pads on which semiconductor chips will be bonded;
• c) placing a lead retaining member on respective surfaces of at least the internal inner lead portions and the frame rails and thereby getting the internal inner lead portions and the frame rails retained by the retaining member, the surfaces on which the retaining member is placed being either the same as, or opposite to, the upper surface of the die pads on which the chips will be bonded;
• d) removing, from at least some of the internal inner lead portions, respective parts thereof located between the convex portions and the associated die pads, thereby forming internal inner leads that have been selectively isolated from the die pads and obtaining a leadframe with the lead retaining member;
• e) bonding the chips onto the upper surface of the die pads of the leadframe;
• f) electrically connecting the chips to the isolated internal inner leads and the external inner lead portions using metal fine wires;
• if the lead retaining member has been placed on the surface of the leadframe on which the chips have been bonded,
• g) removing the lead retaining member from the surface of the leadframe on which the chips have been bonded;
• h) molding the chips, the die pads, the internal inner leads and the external inner lead portions together with a resin encapsulant so that the convex portions of the internal inner leads and the external inner lead portions have their top exposed;
• if the lead retaining member has been placed on another surface of the leadframe opposite to the surface thereof on which the chips have been bonded,
• i) removing the lead retaining member from the opposite surface of the leadframe;
• and
• j) dividing the leadframe, along with the members assembled thereon, into multiple packages so that each said package includes at least one of the chips.

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) forming frame rails, multiple sets of inner lead portions and die pads out of a single metal plate, wherein each said set of inner lead portions are supported by a first group of joining/supporting members that extend inward from the associated frame rail and are joined together by a second group of joining/supporting members;
• b) forming convex portions on a surface of the inner lead portions so that the convex portions are spaced apart from each other, the surface being opposite to an upper surface of the die pads on which semiconductor chips will be bonded;
• c) placing a lead retaining member on respective surfaces of the inner lead portions and the frame rails and thereby getting the inner lead portions and the frame rails retained by the retaining member, the surfaces on which the retaining member is placed being either the same as, or opposite to, the upper surface of the die pads on which the chips will be bonded;
• d) removing, from at least some of the joining/supporting members of the second group for the inner lead portions, respective parts thereof located between adjacent ones of the convex portions or between one of the convex portions and the associated die pad that are adjacent to each other, thereby forming inner leads that have been selectively isolated from the die pads and obtaining a leadframe with the lead retaining member;
• e) bonding the chips onto the upper surface of the die pads of the leadframe;
• f) electrically connecting the chips to the isolated inner leads using metal fine wires;
• if the lead retaining member has been placed on the surface of the leadframe on which the chips have been bonded,
• g) removing the lead retaining member from the surface of the leadframe on which the chips have been bonded;
• h) molding the chips, the die pads and the inner leads together with a resin encapsulant so that the convex portions of the inner leads have their top exposed;
• if the lead retaining member has been placed on another surface of the leadframe opposite to the surface thereof on which the chips have been bonded,
• i) removing the lead retaining member from the opposite surface of the leadframe;
• and
• j) dividing the leadframe, along with the members assembled thereon, into multiple packages so that each said package includes at least one of the chips.

A method for manufacturing a resin-molded semiconductor device, comprising the steps of:

• a) forming frame rails, multiple sets of lands, multiple sets of inner leads and die pads out of a single metal plate, wherein each said set of lands are supported by joining/supporting members extending inward from the associated frame rail and are joined together so as to be spaced apart from each other, each said set of inner leads electrically connect some of the lands together and each said die pad has an upper surface on which a semiconductor chip will be bonded;
• b) placing a lead retaining member on respective surfaces of the lands and the frame rails and thereby getting the lands and the frame rails retained by the retaining member, the surfaces on which the retaining member is placed being either the same as, or opposite to, the upper surface of the die pads on which the chips will be bonded;
• c) removing, from at least some of the joining/supporting members, respective parts thereof located between adjacent ones of the lands, thereby selectively isolating the lands and obtaining a leadframe with the lead retaining member;
• d) bonding the chips onto the upper surface of the die pads of the leadframe;
• e) electrically connecting the chips to the isolated inner leads using metal fine wires;
• if the lead retaining member has been placed on the surface of the leadframe on which the chips have been bonded,
• f) removing the lead retaining member from the surface of the leadframe on which the chips have been bonded;
• g) molding the chips, the die pads and the inner leads together with a resin encapsulant so that the convex portions of the inner leads have their top exposed;
• if the lead retaining member has been placed on another surface of the leadframe opposite to the surface thereof on which the chips have been bonded,
• h) removing the lead retaining member from the opposite surface of the leadframe;
• and
• i) dividing the leadframe, along with the members assembled thereon, into multiple packages so that each said package includes at least one of the chips.