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US 6,720,206 B2Granted
Method for manufacturing digital micro-mirror device (DMD) packages
AssigneeSamsung Electronics Co., Ltd.
InventorJong-Kon Choi
Life of this patent
Estimating the term…
Abstract
A method for manufacturing a semiconductor package is disclosed. A wafer including a plurality of semiconductor chips is provided. Each chip has one or more mirrors mounted thereon. Further, a plurality of bond pads formed on a periphery of the chip. Next, a photoresist is formed over the one or more mirrors. Then, the semiconductor chips are singulated from the wafer. One ore more semiconductor chips are mounted on a base substrate. The bond pads of the semiconductor chip are electrically connected with the base substrate. The photoresist is then removed from the semiconductor chips.
Claims19
A method for manufacturing a semiconductor package, said method comprising:
- providing a wafer including one or more semiconductor chips, each chip comprising an active surface and a back surface, and having one or more mirrors formed on the active surface and a plurality of bond pads formed of a periphery of the chip;
- forming a photoresist over the one or more mirrors;
- singulating the one or more semiconductor chips from the wafer;
- attaching the back surface of the one or more semiconductor chip to a top surface of a base substrate;
- electrically interconnecting the bond pads of the semiconductor chip to the base substrate;
- and
- removing the photoresist from the semiconductor chips after the electrically interconnecting the bond pads to the base substrate.
4 more elements
A method for manufacturing digital micro-mirror device (DMD) packages, said method comprising:
- providing a wafer including a plurality of DMD semiconductor chips, each chip comprising an active surface and a back surface and having one or more mirrors formed on substantially the center of the active surface of the chip, a plurality of electrode pads formed on the periphery of the active surface;
- forming a photoresist over the mirrors;
- forming a metallic layer on a back surface of the wafer;
- separating the wafer into the individual semiconductor chips;
- attaching the back surface of each semiconductor chip to an upper surface of a base substrate using a metallic adhesive;
- interconnecting the electrode pads of the semiconductor chip to the base substrate with one or more bonding wires;
- removing the photoresist from the semiconductor chips after interconnecting the electrode pads to the base substrate;
- forming an anti-sticking film on the active surface of the semiconductor chip for protecting the semiconductor chips from dust and moisture;
- and
- hermetically sealing the semiconductor chip and the bonding wires on the upper surface of the base substrate.
7 more elements
A method for manufacturing a semiconductor package, said method comprising:
- providing a wafer including one or more semiconductor chips, each chip comprising an active surface and a back surface and having one or more mirrors and electrodes formed on the active surface;
- coating the one or more mirrors with a photoresist film;
- singulating the one or more semiconductor chips from the wafer;
- attaching the back surface of the one or more semiconductor chip to a top surface of a base substrate using a metallic adhesive;
- electrically interconnecting the electrodes of the semiconductor chip to the base substrate;
- and
- removing the coated photoresist film from the one or more mirrors of the semiconductor chips after the interconnection.
4 more elements
A method for manufacturing a semiconductor package, said method comprising:
- providing a wafer including one or more semiconductor chips, each chip comprising an active surface and a back surface, and having one or more mirrors formed on the active surface and a plurality of bond pads formed on a periphery of the chip;
- forming a photoresist over the one or more mirrors;
- forming a metallic layer over a back surface of the wafer;
- singulating the one or more semiconductor chips from the wafer;
- attaching the back surface of the one or more semiconductor chip to a top surface of a base substrate using a metallic adhesive;
- electrically interconnecting the bond pads of the semiconductor chip to the base substrate;
- and
- removing the photoresist from the semiconductor chips after the electrically interconnecting the bond pads to the base substrate.
5 more elements
A method for manufacturing digital micro-mirror device (DMD) packages, said method comprising:
- providing a wafer including a plurality of DMD semiconductor chips, each chip comprising an active surface and a back surface and having one or more mirrors formed on substantially the center of the active surface of the chip, a plurality of electrode pads formed on the periphery of the active surface;
- forming a photoresist over the mirrors;
- forming a metallic layer on a back surface of the wafer;
- separating the wafer into the individual semiconductor chips;
- attaching the back surface of each semiconductor chip to an upper surface of a base substrate using a metallic adhesive;
- interconnecting the electrode pads of the semiconductor chip to the base substrate with one or more bonding wires;
- removing the photoresist from the semiconductor chips after interconnecting the electrode pads to the base substrate;
- forming an anti-sticking film on the active surface of the semiconductor chip for protecting the semiconductor chips from dust and moisture;
- and
- hermetically sealing the semiconductor chip and the bonding wires on the upper surface of the base substrate at a predetermined temperature not higher than the temperature on which said attaching the semiconductor chip to the base substrate is performed.
7 more elements
Dependencies are inferred from the claim text.