# US 6,720,195 B2 · Methods employing elevated temperatures to enhance quality control in microelectronic component manufacture > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 6,720,195 B2 - Document ID: US6720195B2 - Status: Granted - Kind: B2 - Application number: 10/145,986 - Filed: 2002-05-15 - Published: 2003-11-20 - Granted: 2004-04-13 - Earliest claimed: 2002-05-15 - Assignees: Micron Technology, Inc. - Inventors: David G. Jensen - Web page: https://patentgrep.com/patent/US6720195B2 ## CPC - H10P 74/23: {characterised by multiple measurements, corrections, marking or sorting processes} - H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Aspects of the invention provide various methods and apparatus for delivering more reliable packaged microelectronic components. One embodiment provides a method in which packaged microelectronic components are heated to a reflow temperature of a selected solder before the solder is applied. After the solder is applied, the performance of the packaged microelectronic component can be tested and any packaged microelectronic component that fails to meet minimum performance criteria can be rejected as defective. Such a process may help identify microelectronic components that may pass normal testing procedures, but fail during a subsequent solder reflow operation. One embodiment provides a system that includes a suitable heating apparatus and a solder plating apparatus, with the heating apparatus being adapted to heat and cool packaged microelectronic components before they are delivered to the solder plating apparatus. ## Claims ### Claim 1 A method of processing a packaged microelectronic component including at least one die, comprising: heating the packaged microelectronic component to a reflow temperature of a selected solder; after the heated packaged microelectronic component has cooled to a temperature below the reflow temperature, applying the selected solder to contacts carried by the cooled packaged microelectronic component; testing performance of the solder-bearing packaged microelectronic component; and rejecting as defective any packaged microelectronic component that fails to meet minimum performance criteria in the performance testing. ### Claim 2 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component comprises heating the packaged microelectronic component at a rate of at least about 5° C./second. ### Claim 3 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component comprises heating the packaged microelectronic component at a rate of at least about 8° C./second. ### Claim 4 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component comprises heating the packaged microelectronic component at a ramp rate greater than a ramp rate at which the packaged microelectronic component will be heated in a subsequent solder reflow operation. ### Claim 5 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component further comprises heating the packaged microelectronic component to a temperature greater than the reflow temperature. ### Claim 6 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component comprises heating the packaged microelectronic component to a temperature of about 215-230° C. ### Claim 7 (depends on 1) The method of claim 1 wherein heating the packaged microelectronic component comprises heating the packaged microelectronic component to a temperature of at least about 220° C. ### Claim 8 (depends on 1) The method of claim 1 wherein the testing comprises heating the microelectronic component to an elevated test temperature that is below the reflow temperature. ### Claim 9 (depends on 1) The method of claim 1 wherein the testing is conducted after the solder is applied to the contacts and the testing comprises heating the microelectronic component to an elevated test temperature that is below the reflow temperature. ### Claim 10 (depends on 1) The method of claim 1 wherein the packaged microelectronic component is heated to the reflow temperature in a heating chamber operatively associated with a solder plating apparatus used to apply the solder. ### Claim 11 (depends on 10) The method of claim 10 wherein the packaged microelectronic component is transferred directly from the heating chamber to the solder plating apparatus. ### Claim 12 (depends on 1) The method of claim 1 wherein the packaged microelectronic component is removed from a magazine carrying a plurality of other microelectronic components before heating the packaged microelectronic component to the reflow temperature. ### Claim 13 (depends on 1) The method of claim 1 wherein the packaged microelectronic component is mounted on a mounting tape, heating the packaged microelectronic component comprising heating the packaged microelectronic component and the tape. ### Claim 14 (depends on 1) The method of claim 1 wherein the packaged microelectronic component is mounted on a mounting tape, heating the packaged microelectronic component comprising heating the packaged microelectronic component and the tape, the packaged microelectronic component being removed from the mounting tape prior to the performance testing. ### Claim 15 (depends on 1) The method of claim 1 wherein the contacts of the packaged microelectronic component include at least one lead and applying the solder to the contacts comprises depositing solder on the at least one lead. ### Claim 16 (depends on 15) The method of claim 15 further comprising trimming the at least one lead. ### Claim 17 A method of processing packaged microelectronic components at least one of which includes at least one die, comprising: heating a plurality of packaged microelectronic components to a stress temperature of at least about 215° C.; thereafter, applying a solder to a contact carried by at least one of the packaged microelectronic components; testing performance of the at least one solder-bearing packaged microelectronic component; and rejecting as defective any packaged microelectronic component that fails to meet minimum performance criteria in the performance testing. ### Claim 18 (depends on 17) The method of claim 17 wherein heating the packaged microelectronic components comprises heating the packaged microelectronic components at a rate of at least about 5° C./second. ### Claim 19 (depends on 17) The method of claim 17 wherein heating the packaged microelectronic components comprises heating the packaged microelectronic components at a rate of at least about 8° C./second. ### Claim 20 (depends on 17) The method of claim 17 wherein heating the packaged microelectronic components comprises heating the packaged microelectronic components at a ramp rate greater than a ramp rate at which the packaged microelectronic components will be heated in a subsequent solder reflow operation. ### Claim 21 (depends on 17) The method of claim 17 wherein heating the packaged microelectronic components comprises heating the packaged microelectronic components to a temperature of about 215-230° C. ### Claim 22 (depends on 17) The method of claim 17 wherein heating the packaged microelectronic components comprises heating the packaged microelectronic components to a temperature of at least about 220° C. ### Claim 23 (depends on 17) The method of claim 17 wherein the testing comprises heating the microelectronic components to an elevated test temperature that is below 150° C. ### Claim 24 (depends on 17) The method of claim 17 wherein the testing is conducted after the solder is applied to the contacts and the testing comprises heating the at least one solder-bearing microelectronic components to an elevated test temperature that is below 150° C. ### Claim 25 (depends on 17) The method of claim 17 wherein the packaged microelectronic components are heated in a heating chamber operatively associated with a solder plating apparatus used to apply the solder. ### Claim 26 (depends on 25) The method of claim 25 wherein the packaged microelectronic components are transferred directly from the heating chamber to the solder plating apparatus. ### Claim 27 (depends on 17) The method of claim 17 wherein the packaged microelectronic components are initially carried in a magazine and the packaged microelectronic components are removed from the magazine before the heating of the packaged microelectronic components. ### Claim 28 (depends on 17) The method of claim 17 wherein at least two of the packaged microelectronic components are mounted on a common length of mounting tape, heating the packaged microelectronic components comprising heating the packaged microelectronic components and the tape. ### Claim 29 (depends on 17) The method of claim 17 wherein at least two of the packaged microelectronic components are mounted on a common length of mounting tape, heating the packaged microelectronic components comprising heating the packaged microelectronic components and the tape, the packaged microelectronic components being removed from the mounting tape prior to the performance testing. ### Claim 30 (depends on 17) The method of claim 17 wherein the contact comprises a lead and applying the solder to the contact comprise depositing solder on the lead. ### Claim 31 (depends on 30) The method of claim 30 further comprising trimming the lead. ### Claim 32 A method of processing a packaged microelectronic component, comprising: heating the packaged microelectronic component at a rate of at least about 5° C./second to a reflow temperature of a selected solder; after the heated packaged microelectronic component has cooled to a temperature below the reflow temperature, applying the selected solder to a contact carried by the cooled packaged microelectronic component; testing performance of the solder-bearing packaged microelectronic component; and rejecting as defective any packaged microelectronic component that fails to meet minimum performance criteria in the performance testing.