Printed circuit substrate with controlled placement covercoat layer
Assignee3M Innovative Properties Company
InventorsJohn B. Scheibner, Robert M. Anderton, David L. Buster, Kristine J. Williams
Life of this patent
Estimating the term…
Abstract
A covercoated base substrate, comprising a base substrate and a photoimageable covercoat layer having a lead portion extending beyond at least one, wherein the lead portion has a controlled offset distance from the edge, and a printed circuit made from such base substrate having at least one conductor including a trace and a lead wherein the covercoat has a lead portion covering at least one lead. A base substrate may also have an opening formed therethrough, the opening defining an interior edge wherein the covercoat extends beyond that interior edge.
Claims8
A covercoated base substrate, comprising:
- a base substrate having an opening formed therethrough, the opening defining an interior edge;
- and
- a photoimageable covercoat layer having a lead portion extending beyond the interior edge into the opening, the covercoat layer having a controlled offset distance.
Dependencies are inferred from the claim text.