Adhesive and semiconductor devices
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsKimio Yamakawa, Minoru Isshiki, Katsutoshi Mine
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Abstract
An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 μm and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.
Claims11
A device comprising a semiconductor chip bonded to an attachment member for the chip by an adhesive composition comprising a curable polymer composition comprising a spherical filler having an average particle size from greater than 100 to 1.000 μm and a major axis-to-minor ratio from 1 to 1.5, where the content of the spherical filler is 1 weight-ppm to 5 weight percent of the curable polymer composition.
A device comprising a semiconductor chip bonded to an attachment member for the chip by an adhesive composition comprising a curable polymer composition comprising a spherical filler having an average particle size from greater than 100 to 1.000 μm and a major axis-to-minor axis ratio from 1 to 1.5, where the content of the spherical filler is 1 weight-ppm to 1 weight percent of the curable polymer composition.
A device comprising a semiconductor chip bonded to an attachment member for the chip by an adhesive composition comprising a curable polymer composition comprising a spherical filler having an average particle size from greater than 100 to 1,000 μm and a major axis-to-minor axis ratio from 1 to 1.5, and where the standard deviation for the particle size distribution of the filler does not exceed 10% of the average particle size of the spherical filler.
Dependencies are inferred from the claim text.