Loading patent…
AssigneeNational Research Council of Canada
InventorsJan J. Dubowski, Ye Tao, Christophe Py
Estimating the term…
Many integrated circuits require a multilayer structure which contains layer of an organic or polymeric material with a patterned metallic layer on it. Laser patterning has many favorable characteristics but it also damages the organic or polymeric material. A novel method is disclosed that makes possible laser patterning of conductive metal electrode deposited on top of an organic and/or polymeric material without significant ablation of the organic and/or polymeric material. The method can achieve higher patterning resolution, resulting in higher quality integrated circuits. The method is based on the application of a thin coating of an inexpensive anti-reflector deposited on top of the desired metal electrode which in turn lies on the organic and/or polymeric material. The thin anti-reflecting coating allows the use of a lower fluence laser for ablation of metal layer without damaging the underlying organic and/or polymeric material.
A method of ablating layer of material having an ablation damage threshold by laser beam, comprising steps of:
A method of direct laser patterning a multilayer microstructure having at least two layers of different materials, the material in a top layer having a higher ablation damage threshold than that of the remaining layers, comprising steps of:
A method of laser patterning a conductive metal electrode having a higher ablation threshold deposited on a substrate material having a lower ablation threshold comprising steps of:
A method of ablating a layer of material in a composite, the composite including the layer of material and an underlying layer, comprising steps of:
Dependencies are inferred from the claim text.