Active retaining ring support

A wafer carrier for use in chemical mechanical planarization, the wafer carrier comprising:

• a carrier body;
• an annular body defined from an elastomeric material, the annular body having a plurality of removed material regions, wherein each of the removed material regions extend through to define a path through the annular body, each of the plurality of removed material regions being spaced apart from respective ones, the annular body having a maximum compressibility level set by a number and size of the plurality of removed material regions;
• an annular body support, the annular body support being connected to the carrier body and designed to receive the annular body;
• and
• a wafer retaining ring, the wafer retaining ring being configured to mate with the annular body such that the annular body is positioned between the annular body support and the wafer retaining ring, the wafer retaining ring being capable applying a force to the annular body in response to being applied to a polishing pad, the force being capable of compressing the annular body up to the maximum compressibility level.