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US 6,719,844 B2Granted
Deposition method, deposition apparatus, and pressure-reduction drying apparatus
AssigneeKabushiki Kaisha Toshiba
InventorsTatsuhiko Ema, Shinichi Ito
Life of this patent
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Abstract
Using a scan coating method, a liquid film is formed on a substrate having a temperature distribution for correcting a temperature distribution of a liquid film caused by the heat of evaporation due to the volatilization of a solvent contained in the liquid film, and then the solvent is removed from the liquid film to form a coating film.
Claims4
A pressure-reduction drying apparatus comprising:
- a temperature controller on which a substrate to be processed is mounted, for providing a temperature distribution from a first peripheral point of the substrate to a second peripheral point on an opposite side of the first peripheral point thereof, and setting a temperature at the first peripheral point of the substrate higher than a temperature at the second peripheral point of the substrate;
- and
- a pressure-reducing chamber holding the substrate and the temperature controller and connected to a vacuum pump.
Dependencies are inferred from the claim text.