Polishing systems, methods of polishing substrates, and methods of cleaning polishing slurry from substrate surfaces
AssigneeMicron Technology, Inc.
InventorsDan G. Custer, Aaron Trent Ward, Shawn M. Lewis
Life of this patent
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Abstract
The invention encompasses polishing systems for polishing semiconductive material substrates, and encompasses methods of cleaning polishing slurry from semiconductive substrate surfaces. In one aspect, the invention includes a method of cleaning a polishing slurry from a substrate surface comprising: a) providing a substrate surface having a polishing slurry in contact therewith; b) providing a liquid; c) injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid; and d) after the injecting, providing the liquid against the substrate surface to displace the polishing slurry from the substrate surface.
Claims17
A method of preparing a semiconductor processing liquid comprising:
- providing a liquid;
- degassifying the liquid;
- and
- injecting a gas into the liquid to increase a total dissolved gas concentration in the liquid to less than or equal to 550 ppb.
A method of preparing a semiconductor processing liquid comprising:
- providing a deionized liquid;
- degassifying the deionized liquid;
- and
- injecting a gas into the deionized liquid to increase a total dissolved gas concentration in the deionized liquid to less than or equal to 550 ppb.
Dependencies are inferred from the claim text.