Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
AssigneeApplied Materials, Inc.
InventorsManoocher Birang, Nils Johansson, Allan Gleason
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Abstract
An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
Claims3
A pad useful for polishing integrated circuit wafers,
- said pad having at least a portion comprised of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles,
- said polymer sheet being transparent to light having a wavelength within the range extending from the far infrared to ultraviolet,
- wherein said pad comprises a first portion comprised of said solid uniform polymer sheet transparent to light and a second portion comprised of a microporous polyurethane structure.
A pad useful for polishing integrated circuit wafers, said pad having a first portion and a second portion, said first portion comprising a polymer material that is substantially transmissive to light, said second portion comprising a material that has lower transmissivity to light than said first portion, wherein said second portion is a microporous polyurethane structure.
A pad useful for polishing integrated circuit wafers, said pad having a first portion and a second portion, said first portion comprising a polymer material that is substantially transmissive to light, said second portion comprising a material that has lower transmissivity to light than said first portion, wherein said second portion is a microporous polyurethane structure, and said first portion is comprised of a solid uniform polymer sheet with no intrinsic ability to absorb or transport slurry particles.
Dependencies are inferred from the claim text.