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US 6,719,558 B2Granted
Curing light
OwnerDensen Caoinventor
Life of this patent
Estimating the term…
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Claims20
A curing light comprising:
- a primary heat sink capable of dissipating heat created by a semiconductor light source,
- a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials,
- a top opening of said well,
- a bottom of said well,
- a wall of said well, said wall of said well being capable of reflecting light of a particular wavelength,
- a chip mounting pad located in said well in the vicinity of said well bottom, said chip mounting pad being capable of reflecting light of a particular wavelength,
- a semiconductor chip capable of producing light that is useful in curing light-curable materials,
- said semiconductor chip being located in said well on said chip mounting pad,
- said semiconductor chip having a substrate and expitaxial layers,
- said semiconductor chip being oriented on said pad so that said epitaxial layers of said chip are located between said substrate and said chip mounting paid, and so that said substrate is nearer said top opening of said well than said epitaxial layers of said chip.
7 more elements
A curing light comprising:
- a primary heat sink capable of dissipating heat created by a semiconductor light source,
- a well in said heat sink, said well being sized to receive a semiconductor chip capable of producing light that is useful in curing light-curable materials,
- a top opening of said well,
- a bottom of said well,
- a wall of said well, said wall of said well being capable of reflecting light of a particular wavelength,
- a chip mounting pad located in said well in the vicinity of said well bottom, said chip mounting pad being capable of reflecting light of a particular wavelength,
- a semiconductor chip capable of producing light that is useful in curing light-curable materials, said semiconductor chip being located in said wall on said chip mounting pad,
- a plurality of electrode bumps located between said chip and said chip mounting pad for providing electrical connection between said chip and said chip mounting pad
- said semiconductor chip having a substrate and expitaxial layers,
- said semiconductor chip being oriented on said pad so that said epitaxial layers of said chip are located between said substrate and said chip mounting paid, and so that said substrate is nearer said top opening of said well than said epitaxial layers of said chip;
- wherein at least some light produced by said chip is reflected by said mounting pad toward said top opening of said well;
- wherein at least some light produced by said chip is reflected by said wall of said well toward said top opening of said well.
9 more elements
Dependencies are inferred from the claim text.