Carrier element for a semiconductor chip for incorporation into smart cards
AssigneeInfineon Technologies AG
InventorsFrank Püschner, Jürgen Fischer, Josef Heitzer
Life of this patent
Estimating the term…
Abstract
A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.
Claims13
In combination with a semiconductor chip, a carrier element, comprising:
- an encapsulation composition having main surfaces and opposite edges and encapsulating and protecting the semiconductor chip;
- at least two connections disposed on one of said main surfaces of said encapsulation composition along only two of said opposite edges, said at least two connections made of a conductive material and having embossed ends facing one another with a reduced thickness at said embossed ends and with a cross section having a step only on one side of said at least two connections;
- and
- the semiconductor chip disposed on said at least two connections in a region of said reduced thickness and being mechanically connected to said at least two connections resulting in mechanical connections.
In combination with a semiconductor chip, a carrier element to be incorporated into a smart card, the carrier element comprising:
- an encapsulation composition having main surfaces and opposite edges and encapsulating and protecting the semiconductor chip;
- at least two connections disposed on one of said main surfaces of said encapsulation composition along only two of said opposite edges, said at least two connections made of a conductive material and having embossed ends facing one another with a reduced thickness at said embossed ends and with a cross section having a step only on one side of said at least two connections;
- and
- the semiconductor chip disposed on said at least two connections in a region of said reduced thickness and being mechanically connected to said at least two connections resulting in mechanical connections.
Dependencies are inferred from the claim text.