Dual chamber cooling system with cryogenic and non-cryogenic chambers for ultra high vacuum system

A cooling system configured for insertion with a vacuum chamber of an ultra high vacuum system configured to deposit a thin film of vaporized material on at least one substrate located in a deposition region, wherein the cooling system comprises:

• a. a first cooling section, wherein the first cooling section comprises:
• i. a cryoshroud region at least partially enclosing the deposition region, wherein the cryoshroud region is adapted to contain a cryogenic fluid;
• ii. a cryogenic fluid input port adapted to receive the cryogenic fluid into the cryoshroud region;
• iii. a vapor outlet port configured to remove vapor created from heating the cryogenic fluid from the cryoshroud region;
• and
• iv. a phase separator region in fluid connection with the cryoshroud region, wherein the phase separator region provides a near atmospheric pressure vapor barrier over the cryogenic fluid in the first cooling section so that the cryogenic fluid vapor may escape smoothly through said outlet port;
• and
• b. a second cooling section at least partially enclosing a heated source region, wherein the heated source region is defined by at least one path taken by the vaporized source material to reach the deposition region, wherein the second cooling section comprises:
• i. a reservoir containing a circulating non-cryogenic fluid;
• ii. an inlet port configured to receive the non-cryogenic fluid into the reservoir, and
• iii. a drainage port configured to remove the non-cryogenic fluid from the reservoir.

A cooling device for a molecular beam epitaxy system, the device comprising:

• a. a reaction chamber;
• b. a first cooling chamber for cooling a portion of the reaction chamber to cryogenic temperatures, wherein the first cooling chamber is situated within the reaction chamber;
• c. a cryogenic source operatively connected to intermittently introduce a cryogenic fluid into the first cooling chamber;
• d. an exhaust through which vapor from the cryogenic fluid exits the first cooling chamber;
• e. a second cooling chamber adapted to contain a non-cryogenic fluid, wherein the second cooling chamber is situated within the reaction chamber;
• f. an inlet port configured to introduce a non-cryogenic fluid into the second cooling chamber;
• g. a drainage port configured to remove the non-cryogenic fluid from the second cooling chamber;
• and
• h. at least one circulation channel within said second cooling chamber and in fluid communication with said inlet port, configured to circulate the non-cryogenic fluid within the second cooling chamber.