# US 6,718,631 B2 · Process for producing a flexible wiring board

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- Number: US 6,718,631 B2
- Document ID: US6718631B2
- Status: Granted
- Kind: B2
- Application number: 09/912,492
- Filed: 2001-07-26
- Published: 2002-01-31
- Granted: 2004-04-13
- Earliest claimed: 2000-07-27
- Assignees: Sony Chemicals Corp.
- Inventors: Masanori Takeuchi
- Web page: https://patentgrep.com/patent/US6718631B2

## CPC

- H05K 3/4617: {characterized by laminating only or mainly similar single-sided circuit boards}
- H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections}
- H05K 3/06: the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)}
- H05K 3/002: {by liquid chemical etching}
- H05K 3/202: {using self-supporting metal foil pattern}
- H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)}
- H05K 3/4007: {Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465)}
- H05K 2201/0166: Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
- H05K 2201/0195: Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
- H05K 2201/0367: Metallic bump or raised conductor not used as solder bump
- H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
- H05K 2203/0369: Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
- H05K 2203/1476: Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
- Y10T 29/49126: Assembling bases
- Y10T 29/49155: Manufacturing circuit on or in base
- Y10T 29/49165: by forming conductive walled aperture in base
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Process for producing a flexible wiring board by etching a metal foil halfway to form a thick film part and a thin film part, etching the thin film part in order to form a first wiring film having the thick film part and a second wiring film having the thin film part with the first wiring film having a larger thickness than the second wiring film. The sectional area and electrical resistance of the first wiring film can be enlarged, even in cases where the first wiring film and the second wiring film have almost the same width, because of the larger film thickness of the first wiring film.

## Claims

### Claim 1

A process for producing a flexible wiring board which comprises:
etching a metal foil halfway in a thickness direction to form concavities of a predetermined pattern on a surface of said metal foil to form a thick film part having a same thickness as an original thickness of said metal foil and a thin film part having a thickness reduced by a depth of said concavities;
forming a first resin film on the surface of said metal foil on a side where said concavities are formed to cover one side of said thick film part and one side of said thin film part;
providing a resist layer having openings on a face in an opposite side of said metal foil to a side where said first resin film is formed, to expose said thin film part at bottom faces of said openings; and
etching said thin film part, located at said bottom faces of said openings, by the thickness of said thin film part, to separate at least one first part on which said patterned resist layer is provided from at least one second part on which said patterned resist layer is provided in order to form at least one first wiring film having said thick film part and at least one second wiring film having said thin film part, wherein a second resin film is formed on said first resin film in a side where said first and second wiring films are located.

### Claim 2

A process for producing a flexible wiring board which comprises:
etching a metal foil halfway in a thickness direction to form concavities of a predetermined pattern on a surface of said metal foil to form a thick film part having a same thickness as an original thickness of said metal foil and a thin film part having a thickness reduced by a depth of said concavities;
forming a first resin film on the surface of said metal foil on a side where said concavities are formed to cover one side of said thick film part and one side of said thin film part;
providing a resist layer having openings on a face in an opposite side of said metal foil to a side where said first resin film is formed, to expose said thin film part at bottom faces of said openings; and
etching said thin film part, located at said bottom faces of said openings, by the thickness of said thin film part, to separate at least one first part on which said patterned resist layer is provided from at least one second part on which said patterned resist layer is provided in order to form at least one first wiring film having said thick film part and at least one second wiring film having said thin film part, wherein an opening is formed in a part of said first resin film where said first wiring film is disposed.

### Claim 3

A process for producing a flexible wiring board which comprises:
etching a metal foil halfway in a thickness direction to form concavities of a predetermined pattern on a surface of said metal foil to form a thick film part having a same thickness as an original thickness of said metal foil and a thin film part having a thickness reduced by a depth of said concavities;
forming a first resin film on the surface of said metal foil on a side where said concavities are formed to cover one side of said thick film part and one side of said thin film part;
providing a resist layer having openings on a face in an opposite side of said metal foil to a side where said first resin film is formed, to expose said thin film part at bottom faces of said openings; and
etching said thin film part, located at said bottom faces of said openings, by the thickness of said thin film part, to separate at least one first part on which said patterned resist layer is provided from at least one second part on which said patterned resist layer is provided in order to form at least one first wiring film having said thick film part and at least one second wiring film having said thin film part, wherein an opening is formed either in one or both of a part of said second resin film where said first wiring film is located and a part where said second wiring film is disposed.

### Claim 4

A process of producing a flexible wiring board further comprising:
etching a metal toil halfway in a thickness direction to form concavities of a predetermined pattern on a surface of said metal foil to form a thick film part having a same thickness as an original thickness of said metal foil and a thin film part having a thickness reduced by a depth of said concavities;
forming a first resin film on the surface of said metal foil on a side where said concavities are formed to cover one side of said thick film part and one side of said thin film part;
providing a resist layer having openings on a face in an opposite side of said metal foil to a side where said first resin film is formed, to expose said thin film part at bottom faces of said openings; and
etching said thin film part, located at said bottom faces of said openings, by the thickness of said thin film part, to separate at least one first part on which said patterned resist layer is provided from at least one second part on which said patterned resist layer is provided in order to form at least one first wiring film having said thick film part and at least one second wiring film having said thin film part,
forming a resist layer on the face in the opposite side of said metal foil to the side where said first resin film is formed, and
exposing and developing said resist layer to have said openings.