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US 6,718,622 B1Granted
Method of forming an assembly of stacked layers
AssigneeKoninklijke Philips Electronics N.V.
InventorsJoannes B. A. D. Van Zon, Gerardus S. A. M. Theunissen
Life of this patent
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Abstract
In an assembly of layers, a first layer has a recess, a second layer is deposited over the first layer, and a third layer is deposited over the second layer and fills the recess. The material of the third layer is less wear resistant than the second layer. After forming the second layer, the assembly is polished to create a flat and smooth surface. The polishing is stopped upon reaching the second layer.
Claims13
A method comprising the steps of:
- forming a first layer with a recess having a depth;
- forming an intermediate layer by deposition over the first layer;
- forming a second layer by depositing a material on a surface of the intermediate layer and in the recess such that the recess is filled with the material;
- and
- polishing an exposed surface of the second layer to form a plane surface, the plane surface being formed by a portion of the intermediate layer and a remaining portion of the second layer present in the recess, wherein the surface of the intermediate layer has a relatively greater polish resistance than has the exposed surface of the second layer, and wherein the relatively greater polish resistance of the surface of the intermediate layer is used as an indicator for terminating the polishing.
2 more elements
Dependencies are inferred from the claim text.