Infrared image sensor with temperature compensation element
AssigneeDenso Corporation
InventorsHiroshi Ando, Hiroyuki Tarumi, Katsuyoshi Nishii
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Abstract
An infrared image sensor has a sensor array composed of plural sensor elements and provided on a silicon substrate. A temperature compensation element is provided on the silicon substrate for each sensor element adjacently to the sensor element, and performs temperature correction to an output of the sensor element. Accordingly, the infrared image sensor can provide stable output even when environmental temperature varies.
Claims18
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array comprising a plurality of sensor elements provided on the semiconductor substrate, the plurality of sensor elements for respectively providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of sensor elements, and each of the plurality of temperature compensation elements for performing temperature correction to an output of the corresponding one of the plurality of sensor elements.
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array comprising a plurality of sensor elements provided on the semiconductor substrate, the plurality of sensor elements for respectively providing thermal image data by receiving infrared radiation from a measurement member, wherein each of the plurality of sensor elements is formed with a through hole passing through the semiconductor substrate from an irradiation surface of the semiconductor substrate, on which the infrared radiation is incident, to a non-irradiation surface of the semiconductor substrate at an opposite side of the irradiation surface;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of sensor elements for performing temperature correction to an output of the corresponding one of the plurality of sensor elements, wherein the plurality of temperature compensation elements are provided on the non-irradiation surface of the semiconductor substrate.
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array comprising a plurality of sensor elements provided on the semiconductor substrate, the plurality of sensor elements for respectively providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of sensor elements and being disposed at a downstream side of the corresponding one of the plurality of sensor elements in an incident direction of the infrared radiation to the semiconductor substrate, and each of the plurality of temperature compensation elements for performing temperature correction to an output of the corresponding one of the plurality of sensor elements.
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array disposed on the semiconductor substrate and comprising a plurality of blocks, each of the plurality of blocks comprising a plurality of sensor elements, the plurality of sensor elements respectively for providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of blocks for performing temperature correction to outputs from the plurality of sensor elements.
An infrared image sensor comprising:
- a semiconductor substrate having an irradiation surface on which infrared radiation is incident and a non-irradiation surface on an opposite side of the irradiation surface;
- a sensor array disposed on the semiconductor substrate and comprising a plurality of blocks, each of the plurality of blocks comprising a plurality of sensor elements, the plurality of sensor elements respectively for providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of blocks for performing temperature correction to outputs from the plurality of sensor elements, wherein the plurality of temperature compensation elements are provided on the non-irradiation surface so that the infrared radiation is prevented from entering the plurality of temperature compensation elements.
An infrared image sensor comprising:
- a semiconductor substrate having an irradiation surface on which infrared radiation is incident and a non-irradiation surface on an opposite side of the irradiation surface;
- a sensor array disposed on the semiconductor substrate and comprising a plurality of blocks, each of the plurality of blocks comprising a plurality of sensor elements, the plurality of sensor elements respectively for providing thermal image data by receiving infrared radiation from a measurement member, wherein each of the plurality of sensor elements has a through hole opening on the irradiation surface of the semiconductor substrate for receiving the infrared radiation, and a resistor at a bottom of the through hole, and the resistor has a resistance that is changed by the infrared radiation;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of blocks for performing temperature correction to outputs from the plurality of sensor elements.
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array comprising a plurality of sensor elements provided on the semiconductor substrate, the plurality of sensor elements for respectively providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of sensor elements, and each of the plurality of temperature compensation elements for performing temperature correction to an output of the corresponding one of the plurality of sensor elements based on an output of a corresponding one of the plurality of temperature compensation elements.
An infrared image sensor comprising:
- a semiconductor substrate;
- a sensor array disposed on the semiconductor substrate and comprising a plurality of blocks, each of the plurality of blocks comprising a plurality of sensor elements, the plurality of sensor elements respectively for providing thermal image data by receiving infrared radiation from a measurement member;
- and
- a plurality of temperature compensation elements provided on the semiconductor substrate, each of the plurality of temperature compensation elements being arranged adjacent to a corresponding one of the plurality of blocks for performing temperature correction to outputs from the plurality of sensor elements based on an output of a corresponding one of the plurality of temperature compensation elements.
Dependencies are inferred from the claim text.