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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsLi-Chen Chen, Chia-Tsun Hsu, Chia-Fu Lin, Kuo-Ching Lee, Yen-Ming Chen, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su
Estimating the term…
A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.
A DFR laminating and removing system for laminating a DFR layer from a tape onto a substrate and removing a support film from the DFR layer, said system comprising:
A DFR laminating and removing system for laminating a DFR layer from a tape onto a substrate and removing a protective film and a support film from the DFR layer, said system comprising:
Dependencies are inferred from the claim text.