Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system
AssigneeApplied Materials, Inc.
InventorsAmos Dor, Maya Radzinski
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AssigneeApplied Materials, Inc.
InventorsAmos Dor, Maya Radzinski
Estimating the term…
A method and apparatus for providing communication between a defect source identifier and a tool data collection and control system. The defect source identifier collects wafer data until a defect is identified. Upon identification of a defect, a request is sent to the tool data collection and control system to request data of the tool parameters at the time the defect occurred. The tool data collection and control system retrieves the tool parameters and communicates them to the defect source identifier through a network. The tool parameters are processed by the defect source identifier to extract certain wafer data. The selected wafer data is communicated to the tool data collection and control system and is used to execute a prediction model to predict failure possible of the tool elements.
Apparatus for processing a semiconductor wafer comprising:
A method of processing a semiconductor wafer comprising:
A method of processing a semiconductor wafer comprising:
Dependencies are inferred from the claim text.