Butterfly package pallet
AssigneeAxsun Technologies, Inc.
InventorRichard Dee
Life of this patent
Estimating the term…
Abstract
A manufacturing pallet 100 has provisions for supporting an opto-electronic package 10 on a frame 112. Openings 110A, 110B are provided through the frame to enable mechanical access to the opto-electronic package from below the frame. Additionally, lead access openings 114A, 114B are provided to enable electrical access to the leads 12 of the package 10. As a result, the opto-electronic package need not be manipulated. Instead, the package can be carried on the frame, which is then installed directly on top of a given machine. The machine mechanically engages the package via the openings.
Claims15
An opto-electronic package manipulation system, comprising:
- a pallet including a frame having an opening enabling electrical access to electrical leads of an opto-electronic package on the pallet;
- and
- a chuck having lead contacts extending through the opening to engage the electrical leads of the package.
An opto-electronic package manipulation system, comprising:
- a pallet including a frame having at least one opening enabling electrical access to electrical leads of an opto-electronic package supported by the pallet and mechanical access to the opto-electronic package;
- a chuck comprising lead contacts extending through the at least one opening to engage the electrical leads of the package and at least one clamp member extending through the at least one opening to secure the package to the chuck.
Dependencies are inferred from the claim text.