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US 6,714,431 B2Granted
Semiconductor package with a controlled impedance bus and method of forming same
AssigneeRambus Inc.
InventorsNader Gamini, Donald V. Perino
Life of this patent
Estimating the term…
Abstract
An apparatus includes a first substrate having a set of semiconductor devices formed within it. The apparatus also includes a second substrate. A third substrate has a data conductor coupled between first and second connections to the second substrate. The data conductor is coupled to the set of semiconductor devices at respective connection points.
Claims40
A semiconductor system comprising:
- a plurality of contiguous semiconductor devices formed from a semiconductor substrate, where each of said semiconductor devices is separated from an adjacent semiconductor device by a scribe lane;
- a signal line;
- and
- a plurality of electrical connections, each electrically coupling a different one of said plurality of contiguous semiconductor devices to said signal line.
1 more element
A semiconductor module comprising:
- a signal line;
- at least two contiguous semiconductor devices formed from a semiconductor substrate, where adjacent semiconductor devices define a scribe lane there between, and where each of said semiconductor devices is electrically coupled to said signal line.
A semiconductor module comprising:
- a package;
- a signal line disposed at least partially within said package;
- a plurality of contiguous memory devices disposed within said package and formed from a single semiconductor substrate, where each of said semiconductor devices is electrically coupled to signal line.
Dependencies are inferred from the claim text.