Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one another

A method for producing an electrical component with a plurality of chips, which are stacked one above the other and contact-connected to one another, said component being mounted on a component carrier and being contact-connected on the component carrier by a plurality of contact elements provided on the component, said method comprising the steps of producing a first planar chip arrangement by arranging functional chips spaced apart from one another in a grid and filling at least spacings between the chips with a filling agent for the purpose of forming an insulating holding frame that fixes the chips with a chip-dedicated contact-connecting element which serves for the electrical contact-connection to another chip of another chip arrangement, said chip-dedicated contacting elements being provided in the region of the holding frame and having chip-dedicated conductive strips extending thereto;

• producing at least one additional planar chip arrangement according to the steps for producing the first planar chip arrangement;
• forming a stack of the planar chip arrangement including the first planar chip arrangement and all of the additional planar chip arrangements by arranging each additional chip arrangement on the first chip arrangement, so that the chips and the holding frames of the chip arrangements lie one above another and the respective contact-connection elements of the chip arrangements are connected to one another for the electrical chip-to-chip contact-connection;
• and then separating the components, each comprising a plurality of the chips of the individual chip arrangements by separating of the holding frames of the chip arrangements that are fixedly connected to one another.