Thin film, method and apparatus for forming the same, and electronic component incorporating the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKazuyoshi Honda, Masaru Odagiri, Kiyoshi Takahashi, Noriyasu Echigo, Nobuki Sunagare
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Abstract
A method for forming a thin film includes the steps of: supplying a deposition material in the form of a liquid onto a heated surface; heating and vaporizing the deposition material on the heated surface while the deposition material is undergoing movement; and depositing the deposition material onto a deposition surface. The deposition material is supplied onto a position of the heated surface where the vaporized deposition material does not reach the deposition surface.
Claims10
A thin film including an interface between a resin thin film and a metal thin film which are laminated, a concentration of oxygen in the vicinity of the interface between the resin thin film and the metal thin film is higher than a concentration of oxygen in a middle portion of the resin thin film in its thickness direction.
Dependencies are inferred from the claim text.