Reduced stiffness printed circuit head interconnect
AssigneeSeagate Technology LLC
InventorsAdam Karl Himes, Kevin Jon Schulz
Life of this patent
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Abstract
A printed circuit head interconnect of a head gimbal assembly (HGA) has different material thicknesses in different regions of the printed circuit head interconnect. The printed circuit head interconnect includes a lamination sheet of materials having dielectric materials and conductive materials. The regions which need to have a lower stiffness are made thinner than the rest of the regions. The rest of the regions are made thick and robust enough to support the HGA. A method of reducing the thicknesses of the printed circuit head interconnect includes applying a resist mask pattern having a plurality of openings with different sizes so as to obtain different thicknesses of the materials in different regions of the printed circuit head interconnect.
Claims19
An electrical circuit head interconnect for electrically coupling to a magnetic head of a disc drive, the interconnect comprising:
- a dielectric layer;
- and
- a conductive layer disposed on the dielectric layer, the conductive layer forming a plurality of traces on the dielectric layer, the plurality of traces having a first thickness and a second thickness wherein the second thickness is less than the first thickness and the second thickness extends in a region located between the first thickness of the conductive layer;
- and
- wherein the dielectric layer has a first thickness and a second thickness, the second thickness being less than the first thickness wherein the second thickness of the dielectric layer coincides with the second thickness of the conductive layer.
A head gimbal assembly for supporting a magnetic head in a disc drive, the assembly comprising:
- an elongated flexure;
- a gimbal coupling the magnetic head to the flexure;
- and
- an electric circuit head interconnect for electrically coupling to the magnetic head of the disc drive, the interconnect comprising:
- a dielectric layer;
- a conductive layer disposed on the dielectric layer, the conductive layer forming a plurality of traces on the dielectric layer, the plurality of traces having a first thickness and a second thickness wherein the second thickness is less than the first thickness and the second thickness extends in a region located between the first thickness of the conductive layer;
- and
- wherein the dielectric layer has a first thickness and a second thickness, the second thickness being less than the first thickness wherein the second thickness of the dielectric layer coincides with the second thickness of the conductive layer.
Dependencies are inferred from the claim text.