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US 6,714,365 B2Granted
Optical module
AssigneeFurukawa Electric Co., Ltd.
InventorsTakuma Aoki, Hiroshi Matsuura
Life of this patent
Estimating the term…
Abstract
An optical module according to the present invention has a package, an optical element, and a mounting stage interposed between the optical element and the package. The surface of the mounting stage to which the optical element is bonded is smoother than the bottom surface of the package to which the mounting stage is fixed.
Claims8
An optical module comprising
- a package for housing an optical element, said package having a base surface, and
- a member interposed between the optical element and the base surface of said package, said member having a mount surface for mounting the optical element thereto, the mount surface being smoother than the base surface of said package and wherein the mount surface of said member has a maximum height of roughness profile of less than 2 μm, wherein said member includes positioning means for determining relative position between said member and the optical element on the mount surface, and wherein said positioning means has a recess for allowing the optical element to be at least partially fitted therein.
Dependencies are inferred from the claim text.