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US 6,714,105 B2Granted
Micro electro-mechanical system method
AssigneeMotorola, Inc.
InventorsManes Eliacin, Keryn Lian, Junhua Liu, Robert B. Lempkowski
Life of this patent
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Abstract
A meso-scale MEMS device having a cantilevered beam is formed using standard printed wiring board and high density interconnect technologies and practices. The beam includes at least some polymer material to constitute its length, and in some embodiments also comprises a conductive material as a load-bearing component thereof. In varying embodiments, the beam is attached at a location proximal to an end thereof, or distal to an end thereof.
Claims34
A method comprising:
- providing a printed wiring board comprised at least in part of polymer material;
- forming a nonconductive post on the printed wiring board;
- forming a beam at least partially of polymer material;
- attaching the beam to the nonconductive post such that the beam is cantilevered over the printed wiring board.
1 more element
A method of forming an organic micro electro-mechanical system apparatus comprising:
- providing a printed wiring board comprised at least in part of polymer material;
- depositing a polymer material on the printed wiring board;
- partially curing a first portion of the polymer material on the printed wiring board;
- etching at least some uncured portions of the polymer material on the printed wiring board to form a nonconductive post on the printed wiring board;
- forming a beam at least partially of polymer material;
- attaching the beam to the nonconductive post such that the beam is cantilevered over the printed wiring board.
3 more elements
A method of forming an organic micro electro-mechanical system apparatus comprising:
- providing a printed wiring board comprised at least in part of polymer material;
- forming a nonconductive post on the printed wiring board;
- providing a conductive metal carrier;
- coating at least a portion of the conductive metal carrier with a polymer;
- curing at least a portion of the polymer on the conductive metal carrier to define at least a portion of a beam;
- etching at least a portion of the polymer away from the conductive metal carrier to form a beam that is comprised at least in part of the polymer;
- attaching the beam to the nonconductive post;
- removing at least some of the polymer such that the beam is cantilevered over the printed wiring board.
5 more elements
A meso-scale switch comprising:
- a printed wiring board comprised at least in part of polymer material;
- at least two nonconductive posts disposed overlying the printed wiring board;
- a conductive control surface disposed overlying the printed wiring board;
- a plurality of conductive traces disposed overlying the printed wiring board, wherein at least two of the conductive traces have a continuity break;
- a beam comprising:
- a body having a first and second torsional pivot disposed on either side thereof, with the first torsional pivot being disposed atop one of the nonconductive posts and the second torsional pivot being disposed atop another of the nonconductive posts;
- a first conductive portion disposed at least partially opposite the conductive control surface;
- a second conductive portion disposed at least partially opposite the continuity break in a first one of the conductive traces;
- and
- a third conductive portion disposed at least partially opposite the continuity break in a second one of the conductive traces;
- wherein the first and second torsional pivots bias the beam such that:
- at rest when the conductive control surface is not energized, the second conductive portion physically and electrically bridges the continuity break in the first one of the conductive traces and the third conductive portion does not physically and electrically bridge the continuity break in the second one of the conductive traces;
- and
- when the conductive control surface is energized, the third conductive portion physically and electrically bridges the continuity break in the second one of the conductive traces and the second conductive portion does not physically and electrically bridge the continuity break in the first one of the conductive traces.
11 more elements
Dependencies are inferred from the claim text.