Semiconductor inspection apparatus

A semiconductor inspection apparatus comprising:

• a plurality of probes formed on a first side of a substrate;
• a plurality of electrodes formed on a second side of the substrate;
• and
• wiring leads for electrically connecting the plurality of probes and the plurality of electrodes;
• wherein the plurality of probes project from the first side of the substrate, and wherein the apparatus further includes a plurality of support structures for the probes on the substrate, so that each of the probes is on a support structure and so that each of the plurality of support structures is deformable independently from the rest of the substrate, wherein the probes on the support structure are able to move by a displacement distance in response to pressure, and wherein a plurality of through holes are formed from the first side of the substrate to the second side of the substrate, the plurality of probes and the plurality of electrodes are connected via the through holes, and wherein the plurality of probes have a spatial orientation corresponding to a spatial orientation of electrode pads of a wafer being inspected.

A semiconductor inspection apparatus, comprising;

• a substrate;
• a plurality of contacting sections including a plurality of transistors formed on the substrate;
• and
• a plurality of probes formed on the substrate and electrically connected to the transistors;
• and
• wherein the contacting sections have a pitch that aligns with a pitch of electrode pads of a wafer, and the plurality of probes are on deformable support members that allow each probe to move by a displacement distance in response to pressure.