Contact pin for testing microelectronic components having substantially spherical contacts
AssigneeInfineon Technologies AG
InventorArti Prasad-Roth
Life of this patent
Estimating the term…
Abstract
In order to test, in particular, BGA (Ball Grid Array) contacts, the free contact pin end is formed as a suction tube in which a reduced pressure that acts on the end area of the free contact pin end can be produced. If the diameter of the suction tube is less than the diameter of the component contact with which contact is to be made, a mechanical and electrical contact can be produced by sucking an approaching component contact onto the end area of the contact pin end, without having to exert pressure on the rear face of the component.
Claims7
A contact pin for testing a microelectronic component having a substantially spherical contact with a diameter, the contact pin comprising:
- a cylindrical first contact pin end part having an end area, said contact pin end part formed as a suction tube for providing a reduced pressure at said end area;
- said suction tube having an internal diameter being less than the diameter of the spherical contact of the microelectronic component, so that a mechanical and electrical contact can be produced by sucking the spherical contact of the microelectronic component onto said end area of said first contact pin end part as the spherical contact of the microelectronic component approaches said end area of said first contact pin end part.
A spring contact pin for testing a microelectronic component having a substantially spherical contact with a diameter, the contact pin comprising:
- a cylindrical first contact pin end part having an end area, said contact pin end part formed as a suction tube for providing a reduced pressure at said end area;
- said suction tube having an internal diameter being less than the diameter of the spherical contact of the microelectronic component, so that a mechanical and electrical contact can be produced by sucking the spherical contact of the microelectronic component onto said end area of said first contact pin end part as the spherical contact of the microelectronic component approaches said end area of said first contact pin end part.
Dependencies are inferred from the claim text.