Semiconductor device and method of manufacturing same
AssigneeTexas Instruments Incorporated
InventorsNorito Umehara, Yoshikatsu Umeda
Life of this patent
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Abstract
Object: To provide sufficient connection strength between the bonding pads and conductor wires in a wire bonding method. Means for Solution: The bonding pads 20 upon a semiconductor chip 18 are provided with a bonding region 30 and a probe contact region 32, and one end of the conductor wire 22 is bonded to the bonding region 30. The probe contact to the probe contact region 32 is used for making contact to the tips of the test probes in the semiconductor chip inspection step performed prior to the bonding.
Claims20
A semiconductor device comprising:
- a semiconductor chip upon which are disposed roughly upon a straight line a plurality of bonding pads, each of said bonding pads containing a first region as a connection region and a second region for making contact with a testing probe, and said first and second regions are lined up in a direction substantially perpendicular to said straight line, wherein said plurality of bonding pads comprises a first group of bonding pads with said first regions in a first direction and said second regions in a second direction, and a second group of bonding pads provided with said second regions in said first direction and said first regions in said second direction,
- a member provided with a plurality of conductors containing a third region as a connection region electrically connected to each of a plurality of external connection terminals and a securing area for securing said semiconductor chip,
- a plurality of conductor wires that electrically connect said first regions of said plurality of bonding pads to said third regions of said plurality of conductors, and
- an encapsulating member that encapsulates said semiconductor chip and said plurality of conductor wires.
A method of manufacturing semiconductor devices comprising:
- disposing roughly upon a straight line on a semiconductor chip a plurality of bonding pads containing a first region as a connection region and a second region for making contact with a testing probe, and said first and second regions are lined up in a direction perpendicular to said straight line, wherein said plurality of bonding pads comprises a first group of bonding pads with said first regions in a first direction and said second regions in a second direction, and a second group of bonding pads provided with said second regions in said first direction and said first regions in said second direction,
- providing a member with a plurality of conductors containing a third region as a connection region electrically connected to each of a plurality of external connection terminals, and a securing area for securing said semiconductor chip, and
- disposing a plurality of conductor wires to electrically connect said first regions of said plurality of bonding pads to said third regions of said plurality of conductors.
A semiconductor device;
- comprising:
- a plurality of bond pads arranged on a semiconductor chip, each of said bond pads in said plurality comprising a bond region and a probe region, said plurality of bond pads comprising two groups of bond pads, a first group of bond pads arranged with bond regions in a first direction and probe regions in a second direction, and a second group of bond pads arranged with probe regions in said first direction and bond regions in said second direction, wherein said first and second groups are arranged in an alternating manner with each member of said first group adjacent a member of said second groups and with the probe region of each said member of said first prow, adjacent the bond region of said adjacent member of said second proud.
Dependencies are inferred from the claim text.