Semiconductor substract with substantially matched lines
AssigneeMicron Technology, Inc.
InventorsSalman Akram, John O. Jacobson
Life of this patent
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Abstract
A method and apparatus for substantially reducing the need for capacitive and inductive compensation for signal lines on a flip-chip semiconductor device. A flip-chip semiconductor device is disclosed having signal lines of substantially equal length. At least one ground plane is also disposed on the flip-chip device and separated from the signal lines by a dielectric layer. By using a ground plane and signal lines having substantially equal lengths, impedance caused by electromagnetic and electrostatic coupling is significantly reduced, and impedance from signal line length is balanced such that the loads on each of the signal lines, as viewed by the semiconductor die, are substantially equal.
Claims20
A semiconductor substrate comprising:
- an active surface including integrated circuitry therein;
- a dielectric layer disposed over said active surface, said dielectric layer having at least one via therethrough;
- and
- a plurality of conductive lines disposed in said dielectric layer and coupled to said integrated circuitry, wherein each of said plurality of conductive lines has a length substantially equal to each other.
A semiconductor substrate comprising:
- an active surface;
- a first array of connections on said active surface;
- and
- a second array of connections disposed over said active surface, said first array of connections interconnected to said second array of connections through a plurality of conductive lines of substantially equal lengths.
A semiconductor substrate comprising:
- an active surface having integrated circuitry therein;
- and
- a plurality of conductive lines each extending between a portion of said integrated circuitry and a conductive element disposed proximate said active surface, said plurality of conductive lines each having a length substantially equal to each other.
Dependencies are inferred from the claim text.