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US 6,713,878 B2Granted
Electronic element with a shielding
AssigneeSTMicroelectronics S.r.l.
InventorPaul August Jozef Karel Louis Goetschalckx
Life of this patent
Estimating the term…
Abstract
An electronic element having a carrier with an electrically conductive plane. A flipped chip die is mounted on the carrier, the flipped chip die having a backside opposite to a front side directed towards the carrier. The electronic element also has an electromagnetic interference shield with an electrically conductive means that electrically connects an electrically conductive layer of the backside of the flipped chip die to the conductive plane of the carrier.
Claims10
An electronic element comprising:
- a carrier having at least an electrically conductive mass plane;
- a flipped chip die mounted on the carrier, the said flipped chip die having a backside opposite to a front side directed towards the carrier;
- and
- an electromagnetic interference shield electrically connected to the conductive mass plane of the carrier,
- the electromagnetic interference shield comprising:
- an electrically conductive connection means, and
- an electrically conductive layer on the backside of the flipped chip die, wherein the electrically conductive connection means comprises a conductive connection through the flipped chip die, thereby connecting the electrically conductive layer to bond pads on the electrically conductive plane.
4 more elements
Dependencies are inferred from the claim text.