Package for microwave components
AssigneeThales Nederland B.V.
InventorsJan Hendrik Mannak, Ivo Antoni Gerardus Maatman
Life of this patent
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Abstract
A package for a printed circuit and a method for packaging a circuit including exposed components placed on a printed circuit, the circuit including microwave components. At least part of the circuit that contains microwave components is covered with a layer of syntactic foam including a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material. Subsequently, the entire circuit is covered with a moisture-proof top layer.
Claims8
Method for packaging a circuit including microwave components or microwave components and digital components, the components being placed on a printed circuit, comprising:
- covering at least the microwave components with a layer of syntactic foam comprising a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material;
- and
- subsequently covering the circuit with a moisture-proof top layer.
Package for a printed circuit comprising microwave components or microwave components and digital components, wherein the package for the microwave components includes a layer of syntactic foam, and wherein the printed circuit, including the syntactic foam layer, is provided with a moisture-proof top layer.
Dependencies are inferred from the claim text.