Semiconductor package for enhancing heat dissipation

A semiconductor package for enhancing heat dissipation, comprising:

• a die having an active surface;
• a leadframe, including:
• a central-hole die pad having a first surface and a second surface, said first surface being attached to said die;
• and
• a plurality of leads electrically connected to the active surface of said die and separated from said die pad, said leads having a first surface and a second surface opposite the first surface;
• an encapsulant sealing one portion of the first surface of said plurality of leads and said die in said leadframe but not sealing the second surface of the leads;
• and
• a heat sink having a T-type structure including a portion extending in a hole of said die pad and attached to said second surface of said die by a thermally conductive and electrically insulating adhesive glue, said heat sink also being attached to the second surface of said die pad and at least a portion of the second surface of leads in said plurality of leads with said thermally conductive and electrically insulating adhesive glue, said heat sink being constructed as a body whose entire outer surface is exposed to ambient atmosphere and no portion of said heat sink is in contact with said encapsulant.

A semiconductor package for enhancing heat dissipation, comprising:

• a die having an active surface;
• a plurality of leads electrically connected to the active surface of said die, said leads having a first surface and a second surface opposite the first surface;
• an encapsulant sealing said die and at least a portion of the first surface of said leads but not sealing the second surface of the leads;
• and
• a heat sink attached to at least a portion of the second surface of leads in said plurality of leads with a thermally conductive and electrically insulating adhesive glue, said heat sink being constructed as a body whose entire outer surface is exposed to ambient atmosphere and no portion of said heat sink is in contact with said encapsulant.