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AssigneeLamina Ceramics, Inc.
InventorsPonnuswamy Palanisamy, Attiganal Narayanaswamysreeram, Ellen Schwartz Tormey, Barry Jay Thaler, John Connolly, Ramon Ubaldo Martinelli, Ashok Narayan Prabhu, Mark Stuart Hammond, Joseph Mazzochette
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Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.
A low temperature cofired ceramic-metal (LTCC-M) system integrated package comprising:
A low temperature cofired ceramic-metal (LTCC-M) system integrated package comprising:
Dependencies are inferred from the claim text.