Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin

A semiconductor device comprising:

• a seal member formed of an insulating resin;
• a tab whose back side is exposed to a mounting surface of the seal member, the tab having, on a surface thereof opposite to the back side, a semiconductor element fixing area and wire connection areas;
• tab suspension leads exposed to the mounting surface of the seal member and contiguous to the tab;
• a plurality of leads whose back sides are exposed to the mounting surface of the seal member;
• a semiconductor element positioned within the seal member and fixed through an adhesive onto the semiconductor element fixing area on the surface of the tab in such a manner that a back side thereof is opposed to the tab surface;
• a plurality of electrodes formed on a main surface of the semiconductor element;
• electrically conductive wires for electrically connecting the plural electrodes and surfaces of the leads with each other;
• and
• electrically conductive wires for electrically connecting the electrodes on the semiconductor element and the wire connection areas on the tab with each other,
• wherein the tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element;
• and
• wherein a slit which pierces the tab is formed partially in the tab portion positioned between the semiconductor element fixing area and the wire connection areas.