Semiconductor-chip mounting substrate having at least one projection thereon and a pressure holding means

A semiconductor device comprising:

• a substrate having at least one projection thereon, which is integrally molded with said substrate;
• a first bump obtained by forming a conductive layer on said projection;
• and
• a semiconductor chip having a terminal projecting as a second bump on its surface;
• wherein said semiconductor chip is mounted on said substrate such that said first bump contacts said second bump, and said semiconductor device comprises a pressure holding means for providing a required contact pressure between said first bump and said second bump,
• wherein said substrate has a concave, in which said semiconductor chip can be incorporated.
• said first bump is integrally molded at a bottom surface of said concave with said substrate,
• said pressure holding means is a pressure holding member having a first surface adapted to contact a surface opposed to said second bump of said semiconductor chip, and a second surface extending around said first surface,
• wherein the second surface of said pressure holding member is bonded to said substrate such that the first surface of said pressure holding member pushes said semiconductor chip placed in said concave toward said substrate, to thereby provide the required contact pressure between said first bump and said second bump,
• wherein said pressure holding member has a conductive film on at least said first surface, and a first metal film formed on said second surface so as to make an electrical connection with said conductive film, said substrate has a second metal film on a top surface around said concave, and
• wherein the said pressure holding member is bonded to said substrate through an alloy layer generated at an interface between said first metal film and said second metal film.

A semiconductor device comprising:

• a substrate having at least one projection thereon, which is integrally molded with said substrate;
• a first bump obtained by forming a conductive layer on said projection;
• and
• a semiconductor chip having a terminal projecting as a second bump on its surface;
• wherein said semiconductor chip is mounted on said substrate such that said first bump contacts said second bump, and said semiconductor device comprises a pressure holding means for providing a required contact pressure between said first bump and said second bump,
• wherein said substrate has a concave, in which said semiconductor chip can be incorporated,
• said first bump is integrally molded at a bottom surface of said concave with said substrate,
• said pressure holding means is a pressure holding member having a first surface adapted to contact a surface opposed to said second bump of said semiconductor chip, and a second surface extending around said first surface,
• wherein the second surface of said pressure holding member is bonded to said substrate such that the first surface of said pressure holding member pushes said semiconductor chip placed in said concave toward said substrate, to thereby provide the required contact pressure between said first bump and said second bump, and
• wherein said semiconductor chip is an optical element, and said pressure holding member has an aperture in the first surface, through which a transmission of light between said optical element placed in said concave and an outside of the semiconductor device becomes possible.

A semiconductor device comprising:

• a substrate having at least one projection thereon, which is integrally molded with said substrate;
• a first bump obtained by forming a conductive layer on said projection;
• and
• a semiconductor chip having a terminal projecting as a second bump on its surface;
• wherein said semiconductor chip is mounted on said substrate such that said first bump contacts said second bump, and said semiconductor device comprises a pressure holding means for providing a required contact pressure between said first bump and said second bump,
• wherein said substrate has a concave, in which said semiconductor chip can be incorporated,
• said first bump is integrally molded at a bottom surface of said concave with said substrate,
• said pressure holding means is a pressure holding member having a first surface adapted to contact a surface opposed to said second bump of said semiconductor chip, and a second surface extending around said first surface,
• wherein the second surface of said pressure holding member is bonded to said substrate such that the first surface of said pressure holding member pushes said semiconductor chip placed in said concave toward said substrate, to thereby provide the required contact pressure between said first bump and said second bump, and
• wherein said semiconductor chip is an optical element, and said pressure holding member has a window portion made of an optically transparent material, through which a transmission of light between said optical element placed in said concave and an outside of the semiconductor device becomes possible.

A semiconductor device comprising:

• a substrate having at least one projection thereon, which is integrally molded with said substrate;
• a first bump obtained by forming a conductive layer on said projection, and
• a semiconductor chip having a terminal projecting as a second bump on its surface;
• wherein said semiconductor chip is mounted on said substrate such that said first bump contacts said second bump, and said semiconductor device comprises a pressure holding means for providing a required contact pressure between said first bump and said second bump,
• wherein said substrate has a concave, in which said semiconductor chip can be incorporated,
• said first bump is integrally molded at a bottom surface of said concave with said substrate,
• said pressure holding means is a pressure holding member having a first surface adapted to contact a surface opposed to said second bump of said semiconductor chip, and a second surface extending around said first surface,
• wherein the second surface of said pressure holding member is bonded to said substrate such that the first surface of said pressure holding member pushes said semiconductor chip placed in said concave toward said substrate, to thereby provide the required contact pressure between said first bump and said second bump, and
• wherein at least a part of said semiconductor device is encapsulated in a second substrate of a resin material, so that a shrinkage caused by curing of said resin material increases the contact pressure between said first bump and said second bump through said pressure holding member.