Integrated circuit heat sink device including through hole to facilitate communication

A printed circuit board heat sink connection comprising:

• a) a multilayer circuit board further comprising:
• i) a substrate having a signal layer formed on a first surface of said substrate;
• ii) a metal ground layer adjacent at least a portion of a second surface of said substrate;
• iii) a heat sink layer;
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• iv) a bonding layer connecting said heat sink layer to said metal ground layer and, where said metal ground layer is not coextensive with said substrate, connecting said heat sink layer to said second surface of said substrate,
• b) a through-hole formed in said multilayer circuit board;
• c) wherein said through-hole extends through said signal layer, said substrate, said bonding layer and said ground layer and only partially extends through said heat sink layer;
• d) wherein said through-hole is partially filled with conductive filler such that said conductive filler fills that portion of said through-hole adjacent said heat sink layer, said bonding layer, and said metal ground layer;
• e) wherein the portion of said through-hole not filled with conductive filler is filled with non-conductive filler such that said metal ground layer and said signal layer are not in electrical communication.

An electronic integrated circuit device comprising:

• a) a printed circuit board further comprising:
• i) a substrate having a signal layer on at least a portion of a first surface of said substrate;
• ii) a metal ground layer adjacent at least a portion of a second surface of said substrate;
• iii) a heat sink layer;
• iv) a bonding layer for affixing said heat sink layer to said metal ground layer and, where said ground layer is not co-extensive with said substrate, to said second surface of said substrate;
• v) a void formed in said substrate, including said signal layer, said ground layer and said bonding layer;
• vi) a through-hole formed in said substrate, including said signal layer and said metal ground layer and continuing through said epoxy layer and partially into said heat sink layer,
• vii) which through-hole is partially plated with conductive plating to place said heat sink layer and said ground layer in electrical and thermal communication and which through-hole is further filled with non-conductive filler to electrically isolate said ground layer from said signal layer;
• b) a heat-generating electronic component having a contact surface;
• c) wherein said void is sized to accept said heat-generating electronic component and wherein said component is mounted in said void;
• d) wherein said component's contact surface is connected to said heat sink layer using solder.