Method for cutting a non-metallic substrate
AssigneeSamsung Electronics Co., Ltd.
InventorsBaek-Kyun Jeon, Dae-Ho Choo, Hyung-Woo Nam, Yong-Joon Kwon
Life of this patent
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Abstract
Disclosed is a method for cutting a non-metallic substrate. A designated cutting line formed on the non-metallic substrate is cut using a thermal stress generated by rapidly heating and cooling the designated cutting line. Further, a shape and an arrangement, etc., of an energy source is optimized, thereby maximizing a cutting speed of the non-metallic substrate and also precisely cutting the non-metallic substrate.
Claims29
A method for cutting a non-metallic substrate, the method comprising:
- scanning a first laser beam having a first axis and a second axis onto a predetermined cutting line formed on the non-metallic substrate to heat the cutting line, a length of the first axis and a length of the second axis having a ratio of about 40:1-80:1;
- applying a thermal stress to the non-metallic substrate to form a scribe line on the predetermined cutting line;
- and
- scanning a second laser beam onto the scribe line to cut the non-metallic substrate.
A method for cutting a non-metallic substrate, the method comprising:
- scanning a first laser beam onto a predetermined cutting line formed on the non-metallic substrate to heat the cutting line;
- applying a thermal stress to the non-metallic substrate to form a scribe line on the predetermined cutting line;
- and
- scanning a second laser beam onto the scribe line to cut the non-metallic substrate, the second laser beam having a first axis and a second axis, lengths thereof having a ratio of about 1.1:1-10:1.
A method for cutting a non-metallic substrate, the method comprising:
- scanning a first laser beam onto a predetermined cutting line formed on the non-metallic substrate to heat the cutting line;
- applying a thermal stress to the non-metallic substrate to form a scribe line on the predetermined cutting line;
- and
- scanning a second laser beam onto the scribe line to cut the non-metallic substrate, the second laser beam being spaced apart from an end portion of the first laser beam by a distance of about 5-30 mm, to cut the non-metallic substrate.
A method for cutting a non-metallic substrate, the method comprising:
- scanning a first laser beam having an elliptical shape onto a predetermined cutting line formed on the non-metallic substrate to heat the cutting line, the first laser beam having a first axis and a second axis, lengths thereof having a ratio of about 40:1-80:1;
- applying a thermal stress to the non-metallic substrate to form a groove-shaped scribe line on the cutting line;
- and
- scanning a second laser beam onto the scribe line to cut the non-metallic substrate, the second laser beam being spaced apart from an end portion of the first laser beam by a distance of about 5-30 mm, to cut the non-metallic substrate, the second laser beam having a third axis and a fourth axis, lengths thereof having a ratio of about 1.1:1-10:1.
Dependencies are inferred from the claim text.