Method and device for thermally connecting the contact surfaces of two substrates
AssigneesPac Tech—Packaging Technologies GmbH, Smart Pac GmbH Technology Services
InventorGhassem Azdasht
Life of this patent
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Abstract
A method and a device for thermally connecting the terminal areas (26, 27) of a contact substrate (11) to the terminal areas (28, 29) of a carrier substrate (12), where the substrates (11, 12) are, in order to produce the connection, arranged in a connecting position such that the terminal areas (26, 28; 27, 29) are situated opposite one another in the plane of the connection, where the contact substrate (11) is heated to the connecting temperature from its rear side that is situated opposite the terminal areas (26, 27) in order to reach the required connecting temperature in the plane of the connection, and where the contact substrate (11) is heated by subjecting the substrate to laser energy.
Claims10
A method for thermal connecting the terminal areas of a contact substrate to the terminal areas of a carrier substrate, the method comprising the steps of:
- depositing adhesive material between the substrates in the plane of the connection;
- arranging the substrates in a connecting position such that the terminal areas are situated opposite one another in the plane of the connection and substantially simultaneously displacing the adhesive material deposit arranged between the substrates in the plane of the connection with the arrangement of the contact substrate in the connecting position, said arranging of the substrates and said displacing of the adhesive simultaneously scaling a gap between the substrates;
- heating the contact substrate to the connecting temperature from a rear side that is situated opposite the terminal areas in order to reach the required connecting temperature in the plane of the connection;
- and
- hating the contact substrate by subjecting the substrate to laser energy to produce a thermal connection between the terminal areas of the substrates.
A method for connecting a contact substrate to a carrier substrate, the method comprising the steps of:
- providing a contact substrate with a terminal area;
- providing a carrier substrate with a terminal area and a receiving area for receiving said contact substrate;
- covering said terminal area and said receiving area of said carrier substrate with an adhesive;
- placing said contact substrate on said adhesive on said carrier substrate;
- moving said contact substrate through said adhesive to have said terminal area of said contact substrate move through said adhesive and cause said terminal area of said contact substrate to touch said terminal area of said carrier substrate;
- heating said contact substrate on a side diametrically opposite from said carrier substrate to produce a thermal connection between said terminal areas of said substrates, said heating being performed by subjecting said contact substrate to laser energy.
Dependencies are inferred from the claim text.