Printed wiring board and method for manufacturing printed wiring board

A printed wiring board comprising:

• an insulator board having a via-hole, a first surface and a second surface that is opposite to the first surface;
• first and second conductor patterns, that include a metal and that are respectively located on the first surface and the second surface to cover the via-hole;
• a unified conductive compound, that is located in the via-hole that includes a first metal and a second metal that has a higher melting point than a heating temperature required for interconnecting the first and second conductor patterns;
• and
• first and second solid phase diffusion layers, that are made of the metal included in the first and second conductor patterns and the first metal, wherein each of the first and second solid phase diffusion layers is located between the unified conductive compound and one of the conductor patterns, and wherein the first and second conductor patterns are electrically interconnected by the unified conductive compound and the first and second solid phase diffusion layers.

A printed wiring board comprising:

• an insulator board having a via-hole, a first surface and a second surface that is opposite to the first surface;
• first and second conductor patterns, that include a metal and that are respectively located on the first surface and the second surface to cover the via-hole;
• and
• a unified conductive compound that is located in the via-hole and that includes a first metal and a second metal that has a higher melting point than a heating temperature required for interconnecting the conductor pattern, wherein:
• the unified conductive compound is an alloy that includes sintered metals including the first metal, and other metal particles including the second metal;
• and
• the first and second conductor patterns are electrically interconnected by the unified conductive compound.