US 6,713,686 B2 · Apparatus and method for repairing electronic packages

Abstract

A multi chip module substrate arranged with repair vias and repair lines extending between repair vias of the chip sites of the module by which repairs can be effected to overcome defects in the module circuits and a method for effecting the repairs of defects in the circuits of this module. A defect can occur in any one of a first signal via, a second signal via, and a circuit line extending between and intended to electrically connect the first signal via and the second signal via. After a defective circuit is identified, the signal vias of the circuit are isolated. Then, the first signal via of the defective circuit is electrically connected to that repair via of the chip site having the first signal via that is connected to that repair via of the chip site having the second signal via and the second signal via of the defective circuit is electrically connected to that repair via of the chip site having the second signal via that is connected to that repair via of the chip site having the first signal via.

Claims20

Dependent claims

A multi chip module substrate comprising:

a plurality of chip sites each having:
(a) a plurality of signal vias, and
(b) a plurality of repair vias;
a circuit line net having a plurality of circuit lines, each said circuit line extending between and intended to electrically connect selected signal vias;
and
a repair line net having a plurality of groups of repair lines, each said repair line extending between and electrically connecting a repair via of one said chip site and a repair via of another said chip site.

3 more elements

A method of repairing an electronic package comprising the steps of:

providing a multi chip module substrate including:
(a) a plurality of chip sites each having:
(1) plurality of signal vias, and
(2) plurality of repair vias,
(b) a circuit line net having a plurality of circuit lines, each said circuit line extending between and intended to electrically connect selected signal vias, and
(c) a repair line net having a plurality of groups of repair lines, each said repair line extending between and electrically connecting a repair via of one said chip site and a repair via of another said chip site;
identifying in a circuit intended to be composed of:
(a) a first signal via in a first chip site,
(b) a second signal via in a second chip site, and
(c) a circuit line extending between and intended to electrically connect said first signal via and said second signal via a defect in one of:
(a) said first signal via,
(b) said second signal via, and
(c) said circuit line extending between and intended to electrically connect said first signal via and said second signal via;
isolating said first signal via;
isolating said second signal via;
electrically connecting said first signal via in said first chip site to that repair via in said first chip site that is connected to a repair via in said second chip site;
and
electrically connecting said second signal via in said second chip site to that repair via in said second chip site that is connected to said repair via in said first chip site connected to said first signal via.

15 more elements

Dependencies are inferred from the claim text.

Apparatus and method for repairing electronic packages

Life of this patent

Apparatus and method for repairing electronic packages

Life of this patent

Abstract

Claims20