Hole grid array package and socket technology
AssigneeIntel Corporation
InventorBrent S. Stone
Life of this patent
Estimating the term…
Abstract
A chip interface assembly and method of assembling a chip interface provide enhanced performance. The chip interface assembly includes a semiconductor package and a socket. The semiconductor package has a female contact architecture, where the female contact architecture is mated with a male contact architecture of the socket. By reversing the traditional male/female arrangement of conventional interconnection interfaces, difficulties associated with signaling throughput, clearance, hardware complexity and electrical losses can be obviated.
Claims27
A chip interface assembly comprising:
- a semiconductor package;
- a socket;
- and
- said semiconductor package having a package substrate with a rigid integrated circuit layer with a female contact architecture, the female contact architecture being mated with a male contact architecture of the socket.
A semiconductor package comprising:
- a package substrate having a socket interface surface;
- surfaces defining a hole grid array (HGA) in the socket interface surface;
- and
- an electrically conductive material lining the surfaces defining the HGA, the electrically conductive material to enable electrical connection between a socket side of the package substrate and one or more integrated circuit (IC) layers of the package substrate.
A socket comprising:
- a base;
- and
- a plurality of contacts disposed within the base;
- said contacts having first ends extending beyond a package interface surface of the base, the contacts to the socket are mated with a rigid integrated circuit layer having a female contact architecture of a package substrate of a semicondutor package.
A chip interface assembly comprising:
- a package substrate having a socket interface surface;
- surfaces defining a hole grid array (HGA) in the socket interface surface;
- a metal plating lining the surfaces defining the HGA, the metal latin to enable electrical connection between a socket side of the package substrate and one or more integrated circuit (IC) layers of the package substrate;
- a socket having a base;
- and
- a plurality of contacts disposed within the base;
- said contacts having first ends extending beyond a package interface surface of the base and second ends coupled to a printed circuit board (PCB);
- said first ends of the contacts having a curvature, the curvature to result in a spring force if the socket is mated with the HGA.
Dependencies are inferred from the claim text.