Wiring board with terminals and method for manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsMasatoshi Takenaka, Shinji Okuma
Life of this patent
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Abstract
In a wiring board having a terminal for connection of circuits in a variety of electronic devices, a joining section of the terminal is placed on a connecting section of a wiring pattern on the top surface of a lower substrate, two layers of adhesives having different softening temperatures are formed between the lower substrate and an upper substrate, and the lower substrate and the upper substrate are cemented sandwiching the joining section. With this structure, a stable holding force can be secured over a wide temperature range.
Claims10
A wiring board with a terminal comprising:
- a lower substrate having a wiring pattern located on a top surface thereof;
- a terminal comprising a metal having a joining section for joining with a connecting section of a wiring pattern of said lower substrate;
- and
- an upper substrate cemented with an adhesive to said lower substrate sandwiching said terminal;
- wherein
- said adhesive comprises, after curing, two layers having different softening temperatures and different reductions of adhesive property with increasing temperature.
A method of forming a wiring board with a terminal comprising:
- placing a joining section of a terminal made of a metal on a connecting section of a wiring pattern formed on a top surface of a lower substrate;
- and
- cementing an upper substrate to said lower substrate with an adhesive in a manner sandwiching said terminal, wherein
- said adhesive comprises two layers, after curing, having different softening temperatures and different reductions of adhesive property with increasing temperature.
Dependencies are inferred from the claim text.