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US 6,713,677 B2Granted
Housing assembly for an electronic device and method of packaging an electronic device
AssigneeInfineon Technologies AG
InventorsReinhard Fischbach, Manfred Fries, Manfred Zaeske
Life of this patent
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Abstract
A housing assembly forms a package for an electronic device. The housing assembly has the electronic device, an external carrier and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening and, on account of its capillary action, closes the interspaces between the semiconductor chip and the housing frame.
Claims17
A housing assembly, comprising:
- a fingertip module including a semiconductor chip formed with a sensor area;
- an external contact carrier connected to said fingertip module;
- a housing frame encasing said fingertip module;
- an underside covering part formed with a filling-in opening;
- said fingertip module, said housing frame, and said underside covering part forming interspaces therebetween;
- and
- capillary-acting epoxy resin filled in said interspaces in a heated state via said filling-in opening, said epoxy resin filling said interspaces and said interspaces being dimensioned to form capillary gaps.
4 more elements
A housing assembly comprising:
- an electronic device formed with contact areas;
- an external contact carrier formed with contact pads, said external contact carrier connected to said electronic device, said external contact carrier forming a part of said electronic device and being formed by a flexible multilayer conductor strip having flat conductors arranged between said contact pads and external contact areas on a flexible substrate, and wherein an insulation layer partly covering said flat conductors;
- a housing frame encasing said electronic device;
- an underside covering part formed with a filling-in opening;
- said electronic device, said housing frame, and said underside covering part forming interspaces therebetween;
- and
- capillary-acting epoxy resin filled in said interspaces in a heated state via said filling-in opening, said epoxy resin filling said interspaces and said interspaces being dimensioned to form capillary gaps.
4 more elements
A method of packaging an electronic device in a housing assembly, which comprises the following method steps:
- providing a plurality of components of the housing assembly, including an electronic device to be packaged, an external contact carrier, and a housing frame with a covering;
- assembling the components of the housing assembly, and orienting the housing frame such that a filling-in opening for a capillary-acting epoxy resin is at a top thereof;
- heating the components to a temperature in a range from 85 to 95° C.;
- filling capillary-acting epoxy resin into the filling-in opening, causing the epoxy resin to propagate into interspaces formed between the electronic device to be packaged, the housing frame, and the covering, forming capillary gaps polymerizing the epoxy resin;
- and
- curing the epoxy resin.
3 more elements
Dependencies are inferred from the claim text.